I am an analog and mixed-signal IC engineer based in Barcelona, working at FlexiIC on innovative organic electronics. Previously, I spent two years at IMASENIC, designing CMOS image sensors and taking projects from specification to tape-out, including a wafer-scale image sensor and SWIR image sensor. My experience covers the full IC design flow, from system definition, schematic and Verilog-AMS design, and HSPICE simulation to layout, verification, and top-level integration, across 180 nm, 130 nm CMOS, and 600 nm organic processes. Earlier, I worked at ASML testing DUV photolithography systems. I hold a Master's degree in Microelectronics from the Universidad de Sevilla and a degree in Electronics and Telecommunication Engineering from the Universitat de Barcelona, and I work in Catalan, Spanish, and English.
ANALOG & MIXED-SIGNAL IC ENGINEER
Miguel Descalzo Pérez
I design analog and mixed-signal circuits in a full-custom ASIC workflow, from schematic and layout through tape-out. I currently work with flexible and organic electronics technologies.
L'Hospitalet de Llobregat · Barcelona, Spain
Design of flexible analog and mixed-signal circuits for sensor acquisition platforms with biomedical and industrial applications, using a VLSI workflow. Responsible for system description, top-level integration, and circuit design in a 600 nm nMOS-only process.
As an experienced member of the team, I am also responsible for defining the system architecture and partitioning it into sub-circuits.
- Project planning and scheduling for a small team of engineers
- Coordination and collaboration with testing and fabrication teams
- Definition of input and output signals
- Top-level integration & verification
- Analog/mixed-signal circuit design (e.g. pad library, current DAC)
Design of analog and mixed-signal circuits for innovative image sensors in a VLSI workflow, using Synopsys Custom Compiler and Calibre. Top-level integration and verification of systems designed in 180 nm and 130 nm processes.
- Planned and scheduled personal responsibilities
- Defined project characteristics against the specification and, together with the team, identified and resolved problems at the circuit level
- Schematic and Verilog-AMS circuit description, followed by layout implementation
- Electrical simulation (HSPICE) and design verification (DRC, LVS, ERC, antenna rule check)
- Post-layout simulation and top-level integration of image sensors
System performance and operational testing before shipment of Deep Ultraviolet (DUV) photolithography systems, verifying sub-systems against the specification and diagnosing issues.
- In-depth testing of sub-systems: lenses, chucks, reticle carrying unit, wafer carrying unit, and more
- Final verification of DUV systems before disassembly and shipment
- Manual clean-room operations: part replacement, rebooting, loading reticles and wafers
Built a system to help automate a headache and migraine study, by exposing participants to visual and auditory stimuli within safe, well-characterized limits.
- Planned how to generate the required stimuli and identified safe exposure thresholds
- Ensured that those thresholds could not be reached by the designed system
- Automated stimuli generation and response capture from the test participant
Undergraduate research in the Communication and Instrumentation Systems group, researching implementations for a 10-bit ADC on a 350 nm process, using Cadence.
- Investigated architectures against the ADC requirements
- Designed and simulated possible solutions
Supported the computer rooms of the Biology Faculty: IT support for students, professors, and researchers, and upkeep of software and hardware.
EDA & SIMULATION
Synopsys Custom Compiler, Cadence Virtuoso, Calibre, KLayout, HSPICE, Verilog-AMS, Verilog
INTEGRATION & VERIFICATION
DRC, LVS, ERC, antenna rule check, post-layout simulation, VLSI top-level assembly and checks
DOMAIN
CMOS image sensors, ADC design, LVDS drivers, analog and mixed-signal IC design, schematic and layout implementation in 350 nm / 180 nm / 130 nm CMOS processes and a 600 nm organic process
LANGUAGES
English, Catalan (native), Spanish (native)
Reach out to discuss interesting circuits, organic microelectronics, or simply to connect.